Behrman Capital Acquires Corfin Industries, LLC

New York, February 20, 2018 – Behrman Capital, a private equity investment firm based in New York and San Francisco, today announced that it has acquired Corfin Industries, LLC (“Corfin” or the “Company”).  Corfin performs a variety of component preparation services for high-reliability microelectronics in the defense, commercial aerospace, space and healthcare industries.  Financial terms of the transaction were not disclosed.

Corfin was founded in 1991 and is based in Salem, New Hampshire.  The Company provides microelectronics component preparation services including tin whisker mitigation through robotic hot solder dip, BGA reballing, lead preparation, testing and related ancillary services including tape & reel as well as kitting.

Grant G. Behrman, Managing Partner of Behrman Capital, said, “Corfin has a well-earned reputation as a trusted defense and aerospace industry supplier, working to prevent catastrophic failures in mission and life critical systems for over 25 years.  This transaction builds upon our own industry track record, following the highly successful sale of Data Device Corporation in 2016.  We see a great opportunity to grow Corfin’s business organically with new and existing customers, as well as through select acquisitions of adjacent suppliers. We look forward to working with the Corfin team to build on the Company’s success to date.”

Behrman is investing in partnership with members of Corfin’s senior management team.  Financing for the transaction was provided by Benefit Street Partners.  Goodwin Procter served as legal counsel for Behrman Capital.

About Behrman Capital

Based in New York City and San Francisco, Behrman Capital was founded in 1991 by Grant G. and Darryl G. Behrman. The firm invests in management buyouts, leveraged buildups and recapitalizations of established growth businesses. The company’s investments are focused in three industries: defense and aerospace, health care services, and specialty manufacturing and distribution. The firm has raised five funds with a combined capital base in excess of $3.0 billion. For more information, please visit www.behrmancap.com.

About Corfin Industries

Corfin Industries (www.corfin.com) performs a variety of component preparation services. With proprietary technology and processes, Corfin’s Robotic Hot Solder Dip (RHSD) process is proven to safely mitigate the risk of Tin Whiskers by robotically refinishing Pb-free COTS component terminations with tin-lead (SnPb). This process eliminates the tin whisker risk, restores solder joint reliability and refinishes components to reliable defense industry standards. In addition, Corfin offers gold mitigation services, BGA re-balling, trim and form services, re-conditioning of bent leads and lead-attachment to LCC packages.

Contact

Mark Semer or Peter Hill
Kekst and Company
(212) 521-4800
mark-semer@kekst.com / peter.hill@kekst.com